Publication

Thermal Expansion behavior of Alumina/SiC CMC System with cracks at Elevated Temperatures

Topic : Thermal Expansion behavior of Alumina/SiC CMC System with cracks at Elevated Temperatures

Presented by : Dr. K.S.S. Aradhya, R. Shankara Reddy

Other Details : “Thermal Expansion behavior of Alumina/SiC CMC System with cracks at Elevated Temperatures”,  NATCON.ME-2005, 11-12 March 2005, GCE, Ramanagaram.

Category :

Department : B E - Mechanical Engineering